来源：学术之家整理 2025-03-18 15:38:43
《Journal Of Electronic Packaging》中文名称：《电子封装杂志》，创刊于1989年，由American Society of Mechanical Engineers(ASME)出版商出版，出版周期Quarterly。
《电子封装杂志》发表的论文采用实验和理论（分析和计算机辅助）方法、途径和技术来解决和解决在电子和光子元件、设备和系统的分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。
范围：微系统封装；系统集成；柔性电子；具有纳米结构的材料和一般小规模系统。
旨在及时、准确、全面地报道国内外ENGINEERING, ELECTRICAL & ELECTRONIC工作者在该领域的科学研究等工作中取得的经验、科研成果、技术革新、学术动态等。
| 机构名称 | 发文量 |
| UNIVERSITY SYSTEM OF GE... | 10 |
| HUAZHONG UNIVERSITY OF ... | 9 |
| STATE UNIVERSITY OF NEW... | 9 |
| AUBURN UNIVERSITY SYSTE... | 8 |
| PENNSYLVANIA COMMONWEAL... | 7 |
| PURDUE UNIVERSITY SYSTE... | 7 |
| UNITED STATES DEPARTMEN... | 7 |
| UNITED STATES DEPARTMEN... | 7 |
| UNIVERSITY SYSTEM OF MA... | 7 |
| INTEL CORPORATION | 6 |
| 国家/地区 | 发文量 |
| USA | 101 |
| CHINA MAINLAND | 38 |
| Taiwan | 11 |
| GERMANY (FED REP GER) | 6 |
| South Korea | 6 |
| England | 5 |
| Canada | 3 |
| France | 3 |
| India | 3 |
| Japan | 3 |
| 文章引用名称 | 引用次数 |
| Review of Thermal Packaging ... | 9 |
| Recent Advances and Trends i... | 7 |
| Study on Reabsorption Proper... | 7 |
| A State-of-the-Art Review of... | 6 |
| Progress and Perspective of ... | 5 |
| Low Temperature Cu-Cu Bondin... | 5 |
| Thermal Metamaterials for He... | 5 |
| Thermal Management and Chara... | 5 |
| A Wire-Bondless Packaging Pl... | 4 |
| Experimentally Validated Com... | 4 |
| 被引用期刊名称 | 数量 |
| INT J HEAT MASS TRAN | 143 |
| J ELECTRON PACKAGING | 97 |
| APPL THERM ENG | 60 |
| IEEE T COMP PACK MAN | 60 |
| MICROELECTRON RELIAB | 26 |
| APPL ENERG | 22 |
| INT J THERM SCI | 20 |
| J MATER SCI-MATER EL | 16 |
| INT COMMUN HEAT MASS | 15 |
| J HEAT TRANS-T ASME | 15 |
| 引用期刊名称 | 数量 |
| J ELECTRON PACKAGING | 97 |
| INT J HEAT MASS TRAN | 82 |
| IEEE T COMP PACK MAN | 71 |
| MICROELECTRON RELIAB | 44 |
| IEEE T ELECTRON DEV | 43 |
| APPL THERM ENG | 34 |
| J HEAT TRANS-T ASME | 27 |
| APPL PHYS LETT | 21 |
| J APPL PHYS | 17 |
| IEEE ELECTR DEVICE L | 14 |
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